AnyLayer PCB |
| These are PCBs that enable free connection between all layers combining laser technology and filled plating technology that allows ultra-fine processing. With the higher degree of design freedom and higher-density wiring, these PCBs are ideal for the needs of downsizing and thinning of smartphones and other high performance devices. |
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Features |
- AnyLayer PCBs with Laser Via and Filled Plating on each layer
- Thinner 0.4mm pitch CSP by AnyLayer interconnection supported
- Mass-production of 10-layer M-VIA Ⅲ (AnyLayer PCBs) for mobile devices
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| Cross section |
Stackup |
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| AnyLayer PCB (M-VIA Ⅲ) |
10-layer M-VIA Ⅲ |
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